Product Usage:
The GZC-SF200 Servo Hot Press is designed for high-precision pressing and bonding in advanced electronics manufacturing. It is ideal for:
Hard glass pressing for TFT or OLED ICs.
Hard glass COF (Chip On Film) pressing.
Flexible display press ICs and FPC wire binding ICs.
PCB board FPC wire binding using the ACF (Anisotropic Conductive Film) process.
Other applications requiring precise low-pressure head heating and alignment.
Key Features:
Temperature Control System:
Uses Japan Omron temperature control constant-temperature heating system.
Ensures precise and stable heating for accurate processing.
Indenter & Pressure Control:
Servo-driven precision: Panasonic servo motor with screw and guide system for stable downward motion. Marble support ensures smooth and accurate press.
Adjustable speed: Downward speed can be easily changed to match product requirements, with buffer speed settings for delicate contacts.
Pressure accuracy: Japan SMC precision pressure regulator with low-friction cylinder ensures stable and precise low-pressure output.
Buffer function: Allows pause during pressing for improved COF expansion control.
Control Program System:
Real-time monitoring and display of each step.
Intuitive parameter settings for easy operation.
Stores up to 30 sets of product model parameters for quick formula switching.
Alignment System:
CCD camera HD alignment ensures precise positioning.
Three-axis fine-tuning platform with vacuum adsorption and auxiliary heating functions.
Advantages:
High precision and repeatability for sensitive electronic components.
Fully programmable and versatile for different product models.
Stable temperature and pressure control reduce defects and improve yield.
Flexible buffer and pause functions enhance COF expansion management.
Product Usage:
The GZC-SF200 Servo Hot Press is designed for high-precision pressing and bonding in advanced electronics manufacturing. It is ideal for:
Hard glass pressing for TFT or OLED ICs.
Hard glass COF (Chip On Film) pressing.
Flexible display press ICs and FPC wire binding ICs.
PCB board FPC wire binding using the ACF (Anisotropic Conductive Film) process.
Other applications requiring precise low-pressure head heating and alignment.
Key Features:
Temperature Control System:
Uses Japan Omron temperature control constant-temperature heating system.
Ensures precise and stable heating for accurate processing.
Indenter & Pressure Control:
Servo-driven precision: Panasonic servo motor with screw and guide system for stable downward motion. Marble support ensures smooth and accurate press.
Adjustable speed: Downward speed can be easily changed to match product requirements, with buffer speed settings for delicate contacts.
Pressure accuracy: Japan SMC precision pressure regulator with low-friction cylinder ensures stable and precise low-pressure output.
Buffer function: Allows pause during pressing for improved COF expansion control.
Control Program System:
Real-time monitoring and display of each step.
Intuitive parameter settings for easy operation.
Stores up to 30 sets of product model parameters for quick formula switching.
Alignment System:
CCD camera HD alignment ensures precise positioning.
Three-axis fine-tuning platform with vacuum adsorption and auxiliary heating functions.
Advantages:
High precision and repeatability for sensitive electronic components.
Fully programmable and versatile for different product models.
Stable temperature and pressure control reduce defects and improve yield.
Flexible buffer and pause functions enhance COF expansion management.
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