PCB Solder Mask LDI Exposure Machine | High-Precision Laser Direct Imaging System

PCB Solder Mask LDI Exposure Machine is a high-precision Laser Direct Imaging (LDI) system designed for solder mask exposure and advanced PCB manufacturing. By replacing traditional phototool-based exposure with digital laser imaging, it delivers superior alignment accuracy, higher resolution, improved production efficiency, and exceptional image consistency.

The machine is ideal for high-volume PCB production, supporting automatic image compensation, precise multilayer alignment, and seamless integration with modern smart manufacturing systems.

Product Overview

The PCB Solder Mask LDI Exposure Machine uses a high-power 405 nm laser source to directly expose solder mask patterns onto printed circuit boards without the need for photographic films. Digital imaging technology eliminates common issues associated with conventional exposure methods, including film distortion, temperature and humidity sensitivity, and alignment inaccuracies.Designed for advanced PCB fabrication, the system offers high-speed processing, automatic expansion and contraction compensation, and excellent registration accuracy for fine-line circuit production.

Key Features

• Laser Direct Imaging (LDI) technology

• High-speed solder mask exposure

• Film-free digital imaging process

• High-resolution laser exposure

• Automatic expansion and contraction 

   

Imaging Performance

Productivity

Processing times exclude PCB loading and unloading.

Supported Data Formats

The machine supports direct import of industry-standard PCB manufacturing files, including:

• Gerber 274D

• Gerber 274X

• ODB++

One-click data import simplifies production preparation and reduces programming time.